The MicoAce 66 is a 6” semi-automatic wafer saw with an impressive Z-lift of 20mm for demanding thick substrate applications.
The 66 can be used for a wide range of applications, not just for cutting silicon wafers. It offers a high level of configurability to get the best performance out of your application.
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Application |
Silicon wafer,silicon wafer composites, Glass,MEMs structures, Ceramics,Photonics |
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Work area |
H |
20mm |
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L |
160mm |
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W |
160mm |
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Blade |
2”,3”,4” 50,76,100mm |
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Chuck-type |
Ceramic or metal vacuum, tapeless jig,mechanical vice , magnetic vice |
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Spindle |
2.4kw 60,000rpm/min 2.4Kw 30,000rpm/min |
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Z axis resolution |
0.0001 mm |
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θ |
360°（continue to rotate） |
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